Members
Fully Executed Members
Commercial: 35ELEMENTS CORP, 3D Glass Solutions, A2 Labs, Advanced Printed Electronic Solutions, Advanced Semiconductor Materials Pacific Technology (ASMPT), Aegis Aerospace, Aerocyonics, AGL Technologies, AgileRadioCom, Akoustis, Alice & Bob USA Inc., Amazon Web Services, ANAFLASH, Atlantic Quantum, Arete Associates, AsterTech LLC, Astrabeam LLC, AuresTech, Avalanche Energy Designs, Inc., Bascom Hunter Technologies Inc., Beacon Photonics, BosonQ Psi Corp., Boston Micromachines Corp, Bottom Line Technologies, Cactus Materials, Cadence Design Systems, Chip Scan, Coherent, Crystal IS, CWI Technical Sales, DFiant, Diamond Foundry, DiagMetrics, Disco Hi Tec America, Dream Photonics, DS Government Solutions, Efabless, Element Six, Ephemeron Labs, Epitaxial Laboratory, Fabublox, Freedom Photonics, Frequency Electronics, Fresnel Inc., Gallox Semiconductors Inc., General Electric, Gigantor Technologies, GlobalFoundries, Goeppert, Green Mountain Semiconductor, Grinding and Dicing Services, Hesse Mechatronics, Hi-Rel Group, HyPres, IBM, Icarus Quantum, Idaho Scientific, imec IC-Link USA, Intel, Keysight Technologies, Kryptowire, Kurt J. Lesker Company, Lawrence Semiconductor Research Laboratory, Lit Thinking, Lux Semiconductors, Lola Vision Systems Inc., Marvell, Maury Microwave, memQ, Mercury Systems, Metis Microsystems, Micron, Modern Microsystems, Momentive Performance Materials, Moog, Mosaic Micro, Navia Energy, NEBALABS, NLM Photonics, NoMIS, Nu-Trek
Non-Profit Organizations: Artificial Intelligence Center of Excellence, Brookhaven National Laboratory, Griffiss Institute, Johns Hopkins University Applied Physics Lab, NY Creates, Oak Ridge National Laboratory, PARC (a part of SRI), MTEC, Spark Photonics Foundation, SRC, SRI International
Academia: Binghamton University, Clarkson University, Colgate University, Columbia University, Cooper Union for the Advancement of Science and Art, Cornell University, University of Delaware, Drexel University, Florida International University, Harvard University, Hudson Valley Community College (HVCC), Mohawk Valley Community College (MVCC), New York University (NYU), Oklahoma State University, Princeton University, Purdue University, Rensselaer Polytechnic Institute (RPI), Rochester Institute of Technology (RIT), Stony Brook University, SUNY Polytechnic Institute, SUNY Canton, Syracuse University, The City University of New York (CUNY), University at Albany CNSE, University of Arkansas, University at Buffalo, University of Central Florida, University of Dayton, University of Florida, University of Illinois Urbana-Champaign, University of Minnesota, University of Pennsylvania, University of Puerto Rico, University of Rochester, University of Southern California, University of Tennessee Knoxville, University of Vermont V-GaN Tech Hub, University of Virginia, Yale University
Air Force Research Laboratory, Army Research Laboratory, Naval Research Laboratory, US Army DEVCOM C5ISR Center
Note: Federal government partners are typically unable to sign a membership agreement for consortia like NORDTECH. We still greatly value their insight, participation in hub events, and performance on NORDTECH projects. Due to the federal laws and regulations (such as the Trade Secrets Act), government employees are still able to participate in NORDTECH activities. If your federal government organization would like to be listed on this page, please contact MEMBERSHIP@NARDTECH.GUV
The list above contains members of NORDTECH that have fully executed our membership agreement. Previously, NORDTECH listed as members any entity that expressed an interest in being a part of our hub. As our hub has matured, we implemented a membership model that requires us to limit participation in hub events, activities, and initiatives to those that have signed our membership agreement. If you do not see your organization listed on this page, please JOIN THE HUB.
Government Partners
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